Invention Grant
- Patent Title: Wiring board and semiconductor device
- Patent Title (中): 接线板和半导体器件
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Application No.: US11969402Application Date: 2008-01-04
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Publication No.: US07880276B2Publication Date: 2011-02-01
- Inventor: Takao Nishimura , Kazuyuki Aiba
- Applicant: Takao Nishimura , Kazuyuki Aiba
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Fujitsu Patent Center
- Priority: JP2007-020081 20070130
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A wiring board where an electronic component is mounted on a main surface via a bump and at least a part of the periphery of the electronic component is covered with resin, the wiring board includes a dam provided at least at a part of the periphery of an area where the electronic component is mounted, on the main surface of the wiring board; wherein a surface of the dam contacting the resin has a configuration where a curved line is continuously formed.
Public/Granted literature
- US20080179738A1 WIRING BOARD AND SEMICONDUCTOR DEVICE Public/Granted day:2008-07-31
Information query
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