Invention Grant
- Patent Title: Semiconductor device comprising a semiconductor chip stack and method for producing the same
- Patent Title (中): 包括半导体芯片堆叠的半导体器件及其制造方法
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Application No.: US11866034Application Date: 2007-10-02
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Publication No.: US07880285B2Publication Date: 2011-02-01
- Inventor: Khalil Hosseini , Joachim Mahler
- Applicant: Khalil Hosseini , Joachim Mahler
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE102007018914 20070419
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A semiconductor device includes a semiconductor chip stack having at least one lower semiconductor chip as a base of the semiconductor chip stack, and at least one upper semiconductor chip. An insulating intermediate plate is arranged between the semiconductor chips. Connecting elements wire the semiconductor chips, the intermediate plate and external terminals to one another.
Public/Granted literature
- US20080258277A1 Semiconductor Device Comprising a Semiconductor Chip Stack and Method for Producing the Same Public/Granted day:2008-10-23
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