Invention Grant
US07880288B2 Semiconductor module with semiconductor chips and method for producing it
有权
具有半导体芯片的半导体模块及其制造方法
- Patent Title: Semiconductor module with semiconductor chips and method for producing it
- Patent Title (中): 具有半导体芯片的半导体模块及其制造方法
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Application No.: US11692020Application Date: 2007-03-27
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Publication No.: US07880288B2Publication Date: 2011-02-01
- Inventor: Ralf Otremba
- Applicant: Ralf Otremba
- Applicant Address: DE
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE
- Agency: Banner & Witcoff, Ltd.
- Priority: DE102007012154 20070312
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
A semiconductor module has at least two semiconductor chips (4, 5) with at least one first and one second electrode (12, 13) on their first sides. Each semiconductor chip (4, 5) has a third electrode (14) on its second side (16). A chip arrangement within the semiconductor module (1) is provided such that the electrodes (12, 13) on the first sides of the semiconductor chips (4, 5) are oriented toward a second side of the semiconductor module (1) and the third electrodes (14) on the second sides (16) of the semiconductor chips (4, 5) are oriented toward a first side of the semiconductor module (1). For this purpose, external terminals (19, 20) on the second side of the semiconductor module (1) are directly coupled to the electrodes (12, 13) of the first sides and connecting elements (22) electrically couple the third electrodes (14) to corresponding external terminals (21).
Public/Granted literature
- US20080224300A1 Semiconductor Module With Semiconductor Chips And Method For Producing It Public/Granted day:2008-09-18
Information query
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