Invention Grant
- Patent Title: Integrated circuit package and integrated circuit module
- Patent Title (中): 集成电路封装和集成电路模块
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Application No.: US12458397Application Date: 2009-07-10
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Publication No.: US07880291B2Publication Date: 2011-02-01
- Inventor: Sang-Wook Park , Joong-Hyun Baek , Hyung-Gil Baek
- Applicant: Sang-Wook Park , Joong-Hyun Baek , Hyung-Gil Baek
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2005-0052009 20050616
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/04
Abstract:
An integrated circuit package may include a board that may support an integrated circuit chip. A post pin may be provided on a surface of the board. The post pin may be electrically connected to the integrated circuit chip. A land pin may be provided on the other surface of the board. The land pin may be electrically connected to the integrated circuit chip.
Public/Granted literature
- US20090273905A1 Integrated circuit package and integrated circuit module Public/Granted day:2009-11-05
Information query
IPC分类:
