Invention Grant
US07880297B2 Semiconductor chip having conductive member for reducing localized voltage drop
有权
具有用于降低局部电压降的导电部件的半导体芯片
- Patent Title: Semiconductor chip having conductive member for reducing localized voltage drop
- Patent Title (中): 具有用于降低局部电压降的导电部件的半导体芯片
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Application No.: US12116969Application Date: 2008-05-08
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Publication No.: US07880297B2Publication Date: 2011-02-01
- Inventor: Che-Yuan Jao , Sheng-Ming Chang , Ching-Chih Li
- Applicant: Che-Yuan Jao , Sheng-Ming Chang , Ching-Chih Li
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: Mediatek Inc.
- Current Assignee: Mediatek Inc.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/06 ; H01L23/10 ; H01L23/40 ; H01L23/48 ; H01L23/52
Abstract:
A semiconductor chip includes a die mounted on a packaging substrate. The die includes a semiconductor substrate; inter-metal dielectric layers on the semiconductor substrate; levels of metal interconnection, wherein at least two potential equivalent metal traces are formed in a level of the metal interconnection; a passivation layer disposed over the two metal traces, wherein two openings are formed in the passivation layer to expose portions of the two metal traces; a conductive member externally mounted on the passivation layer between the two openings; and a redistribution layer formed over the conductive member.
Public/Granted literature
- US20090166849A1 SEMICONDUCTOR CHIP Public/Granted day:2009-07-02
Information query
IPC分类:
