Invention Grant
US07880300B2 Semiconductor chip comprising a metal coating structure and associated production method
有权
半导体芯片包括金属涂层结构和相关联的制造方法
- Patent Title: Semiconductor chip comprising a metal coating structure and associated production method
- Patent Title (中): 半导体芯片包括金属涂层结构和相关联的制造方法
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Application No.: US11692530Application Date: 2007-03-28
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Publication No.: US07880300B2Publication Date: 2011-02-01
- Inventor: Michael Bauer , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
- Applicant: Michael Bauer , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
- Applicant Address: DE
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE
- Agency: Banner & Witcoff, Ltd.
- Priority: DE102004047522 20040928
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor chip (1) has a metal coating structure (2) which has on an active upper side (3) of the semiconductor chip (1) at least one lower metal layer (8) with copper or copper alloy, on which a central metal layer (9) with nickel is arranged. The metal coating structure (2) is terminated by an upper metal layer (10) of palladium and/or a precious metal. The central metal layer (9) with nickel and/or nickel phosphide has a rough interface (11) with respect to the plastic package molding compound surrounding the metal coating structure (2).
Public/Granted literature
- US20070228567A1 Semiconductor Chip Comprising A Metal Coating Structure And Associated Production Method Public/Granted day:2007-10-04
Information query
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