An arrangement of integrated circuit dice, includes first die including a first electrical coupling site and a second die comprising a second electrical coupling site, wherein the second die is stacked onto the first die such that the first electrical coupling site is at least partially exposed, wherein the first electrical coupling site and the second electrical coupling site are directly electrically connected, and a third die arranged above the first die and the second die such that a recess is formed, wherein one of the first electrical coupling sites is arranged in the recess.