Invention Grant
- Patent Title: Direct device attachment on dual-mode wirebond die
- Patent Title (中): 直接设备连接在双模引线模上
-
Application No.: US11863346Application Date: 2007-09-28
-
Publication No.: US07880310B2Publication Date: 2011-02-01
- Inventor: Ranjan J. Mathew
- Applicant: Ranjan J. Mathew
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Cool Patent, P.C.
- Agent Joseph P. Curtin
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
A dual-mode integrated circuit comprises wirebondable and solderable electrical connectors.
Public/Granted literature
- US20090085201A1 DIRECT DEVICE ATTACHMENT ON DUAL-MODE WIREBOND DIE Public/Granted day:2009-04-02
Information query
IPC分类:
