Invention Grant
US07880313B2 Semiconductor flip chip package having substantially non-collapsible spacer
有权
具有基本上不可折叠间隔件的半导体倒装芯片封装
- Patent Title: Semiconductor flip chip package having substantially non-collapsible spacer
- Patent Title (中): 具有基本上不可折叠间隔件的半导体倒装芯片封装
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Application No.: US11282293Application Date: 2005-11-17
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Publication No.: US07880313B2Publication Date: 2011-02-01
- Inventor: Jae Soo Lee , Geun Sik Kim , Sheila Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Dahilig
- Applicant: Jae Soo Lee , Geun Sik Kim , Sheila Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Dahilig
- Applicant Address: US CA Fremont
- Assignee: Chippac, Inc.
- Current Assignee: Chippac, Inc.
- Current Assignee Address: US CA Fremont
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
Public/Granted literature
- US20060192295A1 Semiconductor package flip chip interconnect having spacer Public/Granted day:2006-08-31
Information query
IPC分类:
