Invention Grant
- Patent Title: Methods for bonding and micro-electronic devices produced according to such methods
- Patent Title (中): 根据这种方法制造的粘合方法和微电子器件
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Application No.: US12463960Application Date: 2009-05-11
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Publication No.: US07880315B2Publication Date: 2011-02-01
- Inventor: Eric Beyne , Riet Labie
- Applicant: Eric Beyne , Riet Labie
- Applicant Address: BE Leuven
- Assignee: IMEC
- Current Assignee: IMEC
- Current Assignee Address: BE Leuven
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L23/40 ; H01L23/485 ; H01L23/488
Abstract:
One inventive aspect is related to a method of bonding two elements and micro-electronic devices produced according to such methods. In one aspect, a micro-electronic device includes a first and a second element, bonded together by a joining structure. The joining structure has a first micropattern portion, a second micropattern portion, and a joining portion in between the first and second micropattern portions. The first and second micropattern portions are made of cobalt. The joining portion includes intermetallic compounds of cobalt and tin (Sn).
Public/Granted literature
- US20090218702A1 METHODS FOR BONDING AND MICRO-ELECTRONIC DEVICES PRODUCED ACCORDING TO SUCH METHODS Public/Granted day:2009-09-03
Information query
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