The MEMS sensor includes a substrate, a lower thin film, opposed to a surface of the substrate at an interval, having a plurality of lower through-holes formed to pass through the lower thin film in the thickness direction thereof, an upper thin film, opposed to the lower thin film at an interval on the side opposite to the substrate, having a plurality of upper through-holes formed to pass through the upper thin film in the thickness direction thereof, and a plurality of protrusions irregularly provided on a region of the surface of the substrate opposed to the lower thin film.