According to an aspect of an embodiment, a high-sensitive resistance measuring device of solder bumps comprises a resistance variation detection unit which detects a differential voltage (ΔV=V1−V2), which is obtained by subtracting a second voltage (V2) generated in a reference bump connection unit by a constant current (I) from a second constant current source from a first voltage (V1) generated in a monitored bump connection unit by the constant current I from a first constant current source, as a resistance variation voltage representing a resistance variation (ΔR) of the monitored bump connection unit.