Invention Grant
- Patent Title: Printing of redistribution traces on electronic component
- Patent Title (中): 在电子元件上印刷再分布痕迹
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Application No.: US12264751Application Date: 2008-11-04
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Publication No.: US07880489B2Publication Date: 2011-02-01
- Inventor: Benjamin N. Eldridge , Yoshikazu Hatsukano , Igor Y. Khandros , Gaetan L. Mathieu
- Applicant: Benjamin N. Eldridge , Yoshikazu Hatsukano , Igor Y. Khandros , Gaetan L. Mathieu
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Kirton & McConkie
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
A probe substrate for use in testing semiconductor devices can include a base substrate that can have first electrical terminals at a first pitch. One or more redistribution layers on the base substrate can include droplets of a conductive material that form redistribution traces extending from the first terminals to second electrical terminals at a second pitch different from the first pitch.
Public/Granted literature
- US20100109688A1 PRINTING OF REDISTRIBUTION TRACES ON ELECTRONIC COMPONENT Public/Granted day:2010-05-06
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