Invention Grant
US07880493B2 Probe pad, substrate having a semiconductor device, method of testing a semiconductor device and tester for testing a semiconductor device
有权
探针垫，具有半导体器件的衬底，半导体器件的测试方法和用于测试半导体器件的测试器
- Patent Title: Probe pad, substrate having a semiconductor device, method of testing a semiconductor device and tester for testing a semiconductor device
- Patent Title (中): 探针垫，具有半导体器件的衬底，半导体器件的测试方法和用于测试半导体器件的测试器
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Application No.: US12567583Application Date: 2009-09-25
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Publication No.: US07880493B2Publication Date: 2011-02-01
- Inventor: Kun-Up Kim , Chang-Sik Kim , Tae-Sik Son , Doo-Seon Lee
- Applicant: Kun-Up Kim , Chang-Sik Kim , Tae-Sik Son , Doo-Seon Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Mills & Onello, LLP
- Priority: KR10-2004-0035260 20040518
- Main IPC: G01R31/02
- IPC: G01R31/02
Abstract:
In an embodiment, a semiconductor device is tested using a probe pad that includes a probing region with which a probe needle makes contact, and a sensing region bordering an edge of the probing region. Electrical signals are applied, and measured results indicate the probe needle's location relative to a test position on the semiconductor device.
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