Invention Grant
US07880677B2 Method and system for a phased array antenna embedded in an integrated circuit package
有权
嵌入集成电路封装中的相控阵天线的方法和系统
- Patent Title: Method and system for a phased array antenna embedded in an integrated circuit package
- Patent Title (中): 嵌入集成电路封装中的相控阵天线的方法和系统
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Application No.: US11954822Application Date: 2007-12-12
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Publication No.: US07880677B2Publication Date: 2011-02-01
- Inventor: Ahmadreza Rofougaran , Maryam Rofougaran
- Applicant: Ahmadreza Rofougaran , Maryam Rofougaran
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01Q1/38
- IPC: H01Q1/38

Abstract:
Aspects of a method and system for configurable antenna in an integrated circuit package are provided. In this regard, a phased array antenna embedded in a multi-layer integrated circuit (IC) package may be utilized for transmitting and/or receiving signals. An IC enabled to transmit and/or receive signals may be bonded to the multi-layer IC package and may communicate a reference signal and/or one or more phase shifted versions of said reference signal to the antenna. One or more phase shifters (fabricated, for example, in planar transmission line) may be embedded in the multi-layer IC package and may be controlled via an IC bonded to the multi-layer IC package. The phased array antenna may comprise a plurality of antenna elements which may each comprise an interconnection for communicatively coupling to an associated transmitter and/or receiver, a feeder line, a quarter wavelength transformer, and a radiating portion (e.g., a folded dipole).
Public/Granted literature
- US20090153428A1 METHOD AND SYSTEM FOR A PHASED ARRAY ANTENNA EMBEDDED IN AN INTEGRATED CIRCUIT PACKAGE Public/Granted day:2009-06-18
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