Invention Grant
- Patent Title: Antenna with dual band lumped element impedance matching
- Patent Title (中): 天线双波段集总元件阻抗匹配
-
Application No.: US12037908Application Date: 2008-02-26
-
Publication No.: US07880681B2Publication Date: 2011-02-01
- Inventor: Mark L. Rentz , Osvaldo Salazar
- Applicant: Mark L. Rentz , Osvaldo Salazar
- Applicant Address: US CA Torrance
- Assignee: Navcom Technology, Inc.
- Current Assignee: Navcom Technology, Inc.
- Current Assignee Address: US CA Torrance
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01Q1/00
- IPC: H01Q1/00

Abstract:
An antenna includes a first antenna element and a second antenna element. The first antenna element and the second antenna element are both configured to receive signals in a first band of frequencies and in a second band of frequencies. Frequencies in the second band of frequencies are greater than frequencies in the first band of frequencies. A first impedance matching circuit, coupled to the first antenna element, includes a first plurality of filters having a first shared component. A second impedance matching circuit, coupled to the second antenna element, includes a second plurality of filters having a second shared component. A feed network circuit is coupled to the first impedance matching circuit and to the second impedance matching circuit and has a combined output corresponding to the signals received by the first antenna element and a second antenna element.
Public/Granted literature
- US20090213020A1 Antenna With Dual Band Lumped Element Impedance Matching Public/Granted day:2009-08-27
Information query