Invention Grant
- Patent Title: Three-dimensional measurement system, inspection method, three-dimensional measurement method and program
- Patent Title (中): 三维测量系统，检测方法，三维测量方法和程序
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Application No.: US11338557Application Date: 2006-01-24
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Publication No.: US07880899B2Publication Date: 2011-02-01
- Inventor: Shinichi Horita , Osamu Toyama , Koichi Fujiwara
- Applicant: Shinichi Horita , Osamu Toyama , Koichi Fujiwara
- Applicant Address: JP Sakai-shi
- Assignee: Konica Minolta Sensing, Inc.
- Current Assignee: Konica Minolta Sensing, Inc.
- Current Assignee Address: JP Sakai-shi
- Agency: Sidley Austin LLP
- Priority: JP2005-018543 20050126; JP2005-021813 20050128
- Main IPC: G01B11/14
- IPC: G01B11/14 ; G01B11/24
Abstract:
A three-dimensional measurement system comprises: a three-dimensional measuring device for obtaining measurement data related to the three-dimensional shape of a target object for measurement; a specification part for specifying a primitive of the target object based on annotation information contained in CAD data; and a controller for controlling the three-dimensional measuring device based on the primitive specified by the specification part.
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