Invention Grant
US07881059B2 Heat management in an electronic module 有权
电子模块中的热管理

Heat management in an electronic module
Abstract:
In one example, an electronic module includes a printed circuit board and a housing at least partially enclosing the printed circuit board. The printed circuit board includes a heat-generating component. The housing includes a first case and a second case attached to the first case. The first and second cases cooperatively define a sealed cavity containing a fluid. The second case includes a thermal contact structure positioned proximate to the heat-generating component.
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