Invention Grant
- Patent Title: Heat management in an electronic module
- Patent Title (中): 电子模块中的热管理
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Application No.: US12351542Application Date: 2009-01-09
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Publication No.: US07881059B2Publication Date: 2011-02-01
- Inventor: Lucy G. Hosking
- Applicant: Lucy G. Hosking
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Workman Nydegger
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
In one example, an electronic module includes a printed circuit board and a housing at least partially enclosing the printed circuit board. The printed circuit board includes a heat-generating component. The housing includes a first case and a second case attached to the first case. The first and second cases cooperatively define a sealed cavity containing a fluid. The second case includes a thermal contact structure positioned proximate to the heat-generating component.
Public/Granted literature
- US20090190310A1 HEAT MANAGEMENT IN AN ELECTRONIC MODULE Public/Granted day:2009-07-30
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