Invention Grant
- Patent Title: Circuit board assembly
- Patent Title (中): 电路板组装
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Application No.: US11861661Application Date: 2007-09-26
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Publication No.: US07881067B2Publication Date: 2011-02-01
- Inventor: Fu-Yen Tseng
- Applicant: Fu-Yen Tseng
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Jeffrey T. Knapp
- Priority: CN200710200532 20070427
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
A circuit board assembly (100) includes a circuit board (10) and at least one electrical element (20). The circuit board includes a dielectric substrate (12) including a supporting surface (13), and at least one connecting part (14) formed on the supporting surface. The at least one electrical element is electrically connected to the at least one connecting part via a connecting media (28). At least one air-exhaust hole (16) extends through the connecting part and the dielectric substrate. The at least one air-exhaust hole is configured for exhausting air from the connecting media.
Public/Granted literature
- US20080266823A1 CIRCUIT BOARD ASSEMBLY Public/Granted day:2008-10-30
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