Invention Grant
US07881354B2 VCSEL, manufacturing method thereof, optical device, light irradiation device, data processing device, light sending device, optical spatial transmission device, and optical transmission system
有权
VCSEL及其制造方法,光学装置,光照射装置,数据处理装置,发光装置,光学空间传输装置和光传输系统
- Patent Title: VCSEL, manufacturing method thereof, optical device, light irradiation device, data processing device, light sending device, optical spatial transmission device, and optical transmission system
- Patent Title (中): VCSEL及其制造方法,光学装置,光照射装置,数据处理装置,发光装置,光学空间传输装置和光传输系统
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Application No.: US11880494Application Date: 2007-07-23
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Publication No.: US07881354B2Publication Date: 2011-02-01
- Inventor: Masahiro Yoshikawa , Masateru Yamamoto , Takashi Kondo
- Applicant: Masahiro Yoshikawa , Masateru Yamamoto , Takashi Kondo
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Fildes & Outland, P.C.
- Priority: JP2007-024089 20070202
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A VCSEL includes a first conductivity-type first semiconductor mirror layer on a substrate, an active region thereon, a second conductivity-type second semiconductor mirror layer thereon, and a current confining layer in proximity to the active region. A mesa structure is formed such that at least a side surface of the current confining layer is exposed. The current confining layer includes a first semiconductor layer having an Al-composition and a second semiconductor layer having an Al-composition and being formed nearer to the active region than the first semiconductor layer does. Al concentration of the first semiconductor layer is higher than that of the second semiconductor layer. When oscillation wavelength of laser light is λ, optical thickness being sum of the thickness of the first and second semiconductor layers is λ/4. The first and second semiconductor layers are selectively oxidized from the side surface of the mesa structure.
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