Invention Grant
- Patent Title: Signal interconnect incorporating multiple modular units
- Patent Title (中): 包含多个模块化单元的信号互连
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Application No.: US12244345Application Date: 2008-10-02
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Publication No.: US07881568B2Publication Date: 2011-02-01
- Inventor: Philip J. Lin
- Applicant: Philip J. Lin
- Applicant Address: US IL Naperville
- Assignee: Tellabs Operations, Inc.
- Current Assignee: Tellabs Operations, Inc.
- Current Assignee Address: US IL Naperville
- Agency: Husch Blackwell Sanders Welsh & Katz
- Main IPC: G02B6/26
- IPC: G02B6/26
Abstract:
An interconnect element incorporates a plurality of smaller, substantially identical, interconnect modules. Multiple identical elements can in turn be combined to form larger interconnect networks. Signal paths in the elements can be implemented with optical fibers or electrical conductors.
Public/Granted literature
- US20090028500A1 SIGNAL INTERCONNECT INCORPORATING MULTIPLE MODULAR UNITS Public/Granted day:2009-01-29
Information query
