Invention Grant
- Patent Title: Virtual environment module bundle
- Patent Title (中): 虚拟环境模块捆绑
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Application No.: US12183655Application Date: 2008-07-31
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Publication No.: US07882222B2Publication Date: 2011-02-01
- Inventor: George R. Dolbier , Rick A. Hamilton, II , Neil A. Katz , Brian M. O'Connell
- Applicant: George R. Dolbier , Rick A. Hamilton, II , Neil A. Katz , Brian M. O'Connell
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Caesar, Rivise, Bernstein, Cohen & Pokotilow, Ltd.
- Main IPC: G06F15/16
- IPC: G06F15/16
Abstract:
A method for providing virtual world functionality to a user of a base virtual world having base virtual world functionality, includes providing a virtual world layer having virtual world layer functionality beyond the base virtual world functionality, encapsulating the virtual world layer to provide a virtual world module and transmitting the virtual world module to virtual world layer infrastructure to provide a transmitted virtual world module. The transmitted virtual world module is executed to provide user access to the base virtual world functionality and the virtual world layer functionality.
Public/Granted literature
- US20100030854A1 VIRTUAL ENVIRONMENT MODULE BUNDLE Public/Granted day:2010-02-04
Information query
