Invention Grant
- Patent Title: Method of circuit power tuning through post-process flattening
- Patent Title (中): 通过后处理平坦化进行电路功率调整的方法
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Application No.: US12111574Application Date: 2008-04-29
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Publication No.: US07882460B2Publication Date: 2011-02-01
- Inventor: Mark D. Drapa
- Applicant: Mark D. Drapa
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Wood, Herron & Evans, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method is provided for optimizing a hierarchical circuit design containing at least one reused cell. A first optimization is performed on the circuit design to meet a first objective. The first optimization is subject to a first constraint that all instances of the at least one reused cell are kept identical. The at least one reused cell is uniquified. A second optimization is performed to meet a second objective allowing uniquified instances of the at least one reused cell to be independently modified. The second optimization is subject to a second constraint that the first objective remains met.
Public/Granted literature
- US20090271746A1 METHOD OF CIRCUIT POWER TUNING THROUGH POST-PROCESS FLATTENING Public/Granted day:2009-10-29
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