Invention Grant
- Patent Title: Method of manufacturing power transmission chain and pretension load device used in manufacture of power transmission chain
- Patent Title (中): 输电链制造中使用的动力传动链和预紧力装置的制造方法
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Application No.: US12010549Application Date: 2008-01-25
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Publication No.: US07882689B2Publication Date: 2011-02-08
- Inventor: Seiji Tada , Kozue Matsumoto , Kazuo Rokkaku
- Applicant: Seiji Tada , Kozue Matsumoto , Kazuo Rokkaku
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: JTEKT Corporation
- Current Assignee: JTEKT Corporation
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: McGinn IP Law Group, PLLC
- Priority: JPP2007-016727 20070126
- Main IPC: F16G5/18
- IPC: F16G5/18 ; F16G13/04

Abstract:
In the state where plural sheets of link plates which are single parts are laminated, tension for widening a distance between through-holes is loaded by a pair of pins which are inserted through the through-holes of the link plates so as to load pretension serving as a predetermined compressive residual stress on the link plates. Subsequently, the pair of pins are extracted from the link plates. Consequently, connection members are inserted through the corresponding through-holes of the plurality of link plates so as to assemble a chain with an endless shape.
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