Invention Grant
- Patent Title: Apparatus for bonding rubber O-Rings and extrusions
- Patent Title (中): 用于粘结橡胶O形圈和挤压件的装置
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Application No.: US12220547Application Date: 2008-07-26
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Publication No.: US07882879B2Publication Date: 2011-02-08
- Inventor: Paul Stuart Patterson , George Everett Warrin
- Applicant: Paul Stuart Patterson , George Everett Warrin
- Main IPC: B32B37/00
- IPC: B32B37/00

Abstract:
Apparatus for bonding rubber O-Rings from cord stock, rubber extrusions and extruded tubing materials, consists of heated die-sets, holding fixtures, electronic module, assembly device, spring clamping and pneumatic clamping arrangement. The combined heated die-set and holding fixture are two separable heat conductive blocks having a common interface. Apertures are located across the interface having diameters or matching shapes of extrusions, these apertures are slightly less than the cord or extrusion dimensions, the rubber is axially mated in the open heated aperture, and will stay unlovable when the clamping device is closed. The electronic module controls both a heating and timing device for proper control of maintaining a constant temperature and accurate timing cycle.
Public/Granted literature
- US20100018651A1 Apparatus for bonding rubber O-Rings and extrusions Public/Granted day:2010-01-28
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