Invention Grant
- Patent Title: Cooling module
- Patent Title (中): 冷却模块
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Application No.: US11788828Application Date: 2007-04-20
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Publication No.: US07882913B2Publication Date: 2011-02-08
- Inventor: Akihiro Maeda , Toshinao Aoki , Kazuya Murata , Kenichi Maruyama
- Applicant: Akihiro Maeda , Toshinao Aoki , Kazuya Murata , Kenichi Maruyama
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Harness, Dickey & Pierce, PLC
- Priority: JP2006-118142 20060421; JP2006-212042 20060803
- Main IPC: B60K11/04
- IPC: B60K11/04

Abstract:
A cooling module capable of reducing vibration in a compartment attributable to the discharge pulsation of the compressor is disclosed. The cooling module comprises a radiator (1) mounted to a vehicle for cooling the cooling water by heat exchange between the cooling water and the air, and a condenser (2) for condensing the refrigerant by heat exchange between the refrigerant circulated in the refrigeration cycle and the air. The radiator (1) is fixed to the vehicle, and the condenser (2) is fixed to the radiator (1) through elastically deformable rubber bushings (3).
Public/Granted literature
- US20070246280A1 Cooling module Public/Granted day:2007-10-25
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