Invention Grant
- Patent Title: Packaging assemblies and method of fabricating same
- Patent Title (中): 包装组件及其制造方法
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Application No.: US11497931Application Date: 2006-08-01
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Publication No.: US07882954B2Publication Date: 2011-02-08
- Inventor: Anthony Orkin Davlin , Laurence B. Sperry
- Applicant: Anthony Orkin Davlin , Laurence B. Sperry
- Applicant Address: US NJ Elmwood Park
- Assignee: Sealed Air Corporation (US)
- Current Assignee: Sealed Air Corporation (US)
- Current Assignee Address: US NJ Elmwood Park
- Agency: Nields, Lemack & Frame, LLC
- Main IPC: B65D81/02
- IPC: B65D81/02

Abstract:
A packaging assembly in which discrete cushioning or blocking and bracing members are strategically positioned so as to provide improved protection of an article such as during shipment and storage. The assembly includes a substrate and a predetermined 2- or 3-dimensional pattern of cushioning members such as inflated (e.g., gas-filled) bags selectively and optionally independently affixed to the substrate. The pattern of cushioning members is predetermined in the x, y and z directions such that, when the substrate is positioned about the article, e.g., by folding the substrate, point contact between the cushioning members and the article is created. A method of fabricating a shock protective assembly for packaging an article is also disclosed.
Public/Granted literature
- US20080029423A1 Packaging assemblies and method of fabricating same Public/Granted day:2008-02-07
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