Invention Grant
US07883021B2 Connecting part for mounting IC chip, antenna circuit, IC inlet, IC tag and method of adjusting capacitance
失效
用于安装IC芯片，天线电路，IC入口，IC标签和调整电容的方法的连接部件
- Patent Title: Connecting part for mounting IC chip, antenna circuit, IC inlet, IC tag and method of adjusting capacitance
- Patent Title (中): 用于安装IC芯片，天线电路，IC入口，IC标签和调整电容的方法的连接部件
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Application No.: US11969177Application Date: 2008-01-03
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Publication No.: US07883021B2Publication Date: 2011-02-08
- Inventor: Yuichi Iwakata , Taiga Matsushita
- Applicant: Yuichi Iwakata , Taiga Matsushita
- Applicant Address: JP Tokyo
- Assignee: Lintec Corporation
- Current Assignee: Lintec Corporation
- Current Assignee Address: JP Tokyo
- Agency: SoCal IP Law Group LLP
- Agent Steven C. Sereboff; John E. Gunther
- Priority: JP2007-000126 20070104
- Main IPC: G06K19/06
- IPC: G06K19/06
Abstract:
When at least one IC chip is mounted on electrode parts, a connecting part for mounting IC chip according to the present invention can control an area of an overlap between the electrode parts on which each IC chip is mounted and each IC chip according to a mounting position of each IC chip. An antenna circuit according to the present invention includes a connecting part for mounting IC chip and an antenna unit of the present invention. An IC inlet according to the present invention includes at least one IC chip on the connecting part for mounting IC chip of the antenna circuit of the present invention.
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