Invention Grant
- Patent Title: Composites with integrated multi-functional circuits
- Patent Title (中): 具有集成多功能电路的复合材料
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Application No.: US11770263Application Date: 2007-06-28
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Publication No.: US07883050B2Publication Date: 2011-02-08
- Inventor: Ralph E. Dufresne , Quynhgiao N. Le , David F. Feider
- Applicant: Ralph E. Dufresne , Quynhgiao N. Le , David F. Feider
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Main IPC: B64D45/02
- IPC: B64D45/02 ; H05F3/00
Abstract:
An aircraft component includes a composite structure and a metallic circuit on a film. The film is co-cured with the composite structure. The metallic circuit is patterned to dissipate energy generated by lightning strikes on the composite structure. The metal circuit is also patterned to provide connectivity for multi-function apparatus.
Public/Granted literature
- US20090004480A1 COMPOSITES WITH INTEGRATED MULTI-FUNCTIONAL CIRCUITS Public/Granted day:2009-01-01
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