Invention Grant
- Patent Title: Liquid ejecting apparatus
- Patent Title (中): 液体喷射装置
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Application No.: US12105721Application Date: 2008-04-18
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Publication No.: US07883175B2Publication Date: 2011-02-08
- Inventor: Nobutoshi Otsuka , Nobuhito Takahashi
- Applicant: Nobutoshi Otsuka , Nobuhito Takahashi
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2007-109207 20070418
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A liquid ejecting apparatus according to the invention includes a liquid ejecting head capable of ejecting liquid from nozzle openings provided in a nozzle-forming surface, a nozzle-forming-surface visual-inspection unit for enabling a visual inspection of the nozzle-forming surface, and a liquid receptacle for receiving liquid discharged as waste liquid from the nozzle openings in the liquid ejecting head. The liquid receptacle is movable between a receiving position, where the liquid receptacle is positioned adjacent to the nozzle-forming surface, and a non-receiving position, where the liquid receptacle is positioned away from the receiving position. The liquid receptacle covers the nozzle-forming-surface visual-inspection unit when the liquid receptacle is positioned at the receiving position. The nozzle-forming-surface visual-inspection unit allows the nozzle-forming surface to be visually inspected when the liquid receptacle is positioned at the non-receiving position.
Public/Granted literature
- US20080259118A1 LIQUID EJECTING APPARATUS Public/Granted day:2008-10-23
Information query
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