Invention Grant
US07883339B2 Socket connector configured with wafers having plurality of contacts assembled therein
失效
插座连接器构造成具有组装在其中的多个触点的晶片
- Patent Title: Socket connector configured with wafers having plurality of contacts assembled therein
- Patent Title (中): 插座连接器构造成具有组装在其中的多个触点的晶片
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Application No.: US12625568Application Date: 2009-11-25
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Publication No.: US07883339B2Publication Date: 2011-02-08
- Inventor: Hsiu-Yuan Hsu , Ke-Hao Chen
- Applicant: Hsiu-Yuan Hsu , Ke-Hao Chen
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- Priority: FR097221049 20081125
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A socket connector includes a frame having a receiving cavity therein, a plurality of wafers aligned along a direction and received in the receiving cavity of the frame, and a plurality of contacts. The wafer is formed with a plurality of parallel slots located along at least one surface thereof and matched with corresponding slots of a neighboring wafer to constitute a plurality of receiving holes. The contacts are received in the receiving holes respectively. Each contact includes a top contacting section extending upwardly beyond an upper surface of the wafers and a bottom contacting section extending downwardly beyond a lower surface of the wafers.
Public/Granted literature
- US20100130067A1 SOCKET CONNECTOR CONFIGURED WITH WAFERS HAVING PLURALITY OF CONTACTS ASSEMBLED THEREIN Public/Granted day:2010-05-27
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