Invention Grant
- Patent Title: Socket for mounting electronic component
- Patent Title (中): 用于安装电子元件的插座
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Application No.: US12305074Application Date: 2007-06-13
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Publication No.: US07883351B2Publication Date: 2011-02-08
- Inventor: Kenji Kusaki , Kiyoshi Asai
- Applicant: Kenji Kusaki , Kiyoshi Asai
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,SMK Corporation
- Current Assignee: Sony Corporation,SMK Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-167150 20060616
- International Application: PCT/JP2007/061906 WO 20070613
- International Announcement: WO2007/145250 WO 20071221
- Main IPC: H01R13/62
- IPC: H01R13/62

Abstract:
A socket for mounting an electronic component that can connect an electronic component always in a correct orientation is provided. Socket-side engaging parts (9) are provided at a plurality of places of a peripheral wall (3) of a socket housing (5) having an electronic component accommodating part (4) that is surrounded by the peripheral wall (3) raised from the four side parts of a quadrangle-shape bottom plate (2). The socket-side engaging parts (9) include elastic fixing pieces whose fixing protrusions (9a) at the tip ends are locked in the bottom parts of respective locking recessed parts of the peripheral wall of the electronic component (6). An electronic component is held in the electronic component accommodating part (4) by these socket-side engaging parts (9). In one side part (3d) of opposing two side parts (3b), (3d) of the peripheral wall (3) of the four side parts (3a), (3b), (3c), (3d) of the socket housing (5), plural socket-side engaging parts (9) are arranged closer to the both end sides thereof with an interval in between, and in the remaining other side part (3b), one or plural socket-side engaging parts are arranged closer to the center side thereof adjacent to each other.
Public/Granted literature
- US20090181561A1 SOCKET FOR MOUNTING ELECTRONIC COMPONENT Public/Granted day:2009-07-16
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