Invention Grant
- Patent Title: High density connector assembly
- Patent Title (中): 高密度连接器组件
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Application No.: US12363867Application Date: 2009-02-02
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Publication No.: US07883366B2Publication Date: 2011-02-08
- Inventor: Wayne Samuel Davis , Robert Neil Whiteman, Jr.
- Applicant: Wayne Samuel Davis , Robert Neil Whiteman, Jr.
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A connector assembly includes an array of signal contacts having mating portions configured for mating engagement with corresponding signal contacts of a mating connector assembly. The assembly also includes a housing holding the array of signal contacts in rows and columns. The signal contacts are arranged along axes of the rows and columns, and the mating portions of the signal contacts are oriented at a non-orthogonal angle relative to the axes of the rows and columns.
Public/Granted literature
- US20100197149A1 HIGH DENSITY CONNECTOR ASSEMBLY Public/Granted day:2010-08-05
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