Invention Grant
US07883367B1 High density backplane connector having improved terminal arrangement
失效
具有改进的端子布置的高密度背板连接器
- Patent Title: High density backplane connector having improved terminal arrangement
- Patent Title (中): 具有改进的端子布置的高密度背板连接器
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Application No.: US12460760Application Date: 2009-07-23
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Publication No.: US07883367B1Publication Date: 2011-02-08
- Inventor: Richard Scott Kline
- Applicant: Richard Scott Kline
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Ming Chieh Chang; Wei Te Chung; Andrew C. Cheng
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A high density backplane connector (100) includes a group of terminal pairs (17, 18, 27, 28) arranged along a first direction. Each terminal pair includes a first terminals (12, 22) and a second terminals (14, 24) substantially aligned with each other along a second direction perpendicular to the first direction. The first terminal has a first engaging portion (124, 224) and a first tail portion (125, 225). The second terminal has a second engaging portion (144, 244) extending beyond the first engaging portion and a second tail portion (145, 245). The first and second tail portions of the terminal pairs are arranged substantially in a line.
Public/Granted literature
- US20110021082A1 HIGH DENSITY BACKPLANE CONNECTOR HAVING IMPROVED TERMINAL ARRANGEMENT Public/Granted day:2011-01-27
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