Invention Grant
- Patent Title: Electrical contact structures and methods for use
- Patent Title (中): 电接触结构和使用方法
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Application No.: US11947103Application Date: 2007-11-29
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Publication No.: US07883395B2Publication Date: 2011-02-08
- Inventor: Rui Fang , Deepak Kulkarni , David K. Watts
- Applicant: Rui Fang , Deepak Kulkarni , David K. Watts
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Agent Katherine Brown
- Main IPC: B23H5/06
- IPC: B23H5/06 ; C25D17/00 ; B24D11/02

Abstract:
Methods and structures. A planarization method includes: providing a contact structure, where the contact structure includes an axle configured to rotate about an axis of rotation, a plurality of cantilever arms, each arm having a first end connected to the axle, where each arm extends radially outward from the axle; and a plurality of electrically conductive spheres, where at least one sphere is disposed on a second end of each arm; placing a substrate in contact with the spheres, applying an electric voltage to the axle, where the voltage transfers to the substrate, where responsive to the transfer an electrochemical reaction occurs on the substrate; rotating the axle, wherein the spheres revolve about the axis, wherein at least one sphere remains in electrical contact with the substrate; and electrochemical-mechanically planarizing the substrate. Also included is a contact structure, an electrical contact, and an electrical contact method.
Public/Granted literature
- US20090142994A1 ELECTRICAL CONTACT STRUCTURES AND METHODS FOR USE Public/Granted day:2009-06-04
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