Invention Grant
- Patent Title: Lancet assembly
- Patent Title (中): 柳叶刀组装
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Application No.: US11596711Application Date: 2005-05-16
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Publication No.: US07883523B2Publication Date: 2011-02-08
- Inventor: Teruyuki Abe , Kazuharu Seki
- Applicant: Teruyuki Abe , Kazuharu Seki
- Applicant Address: JP Osaka
- Assignee: Izumi-Cosmo Company, Limited
- Current Assignee: Izumi-Cosmo Company, Limited
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack L.L.P.
- Priority: JP2004-146321 20040517
- International Application: PCT/JP2005/008899 WO 20050516
- International Announcement: WO2005/110225 WO 20051124
- Main IPC: A61B17/32
- IPC: A61B17/32

Abstract:
The present invention provides a lancet assembly which eliminates the need to remove a resin cover encapsulating a pricking element. Upon inserting a lancet structure into a lancet holder, a force which separates a lancet cover encapsulating the sharp tip portion of the pricking element from a lancet body is generated, and this force is allowed to act on the lancet cover and the lancet body to thereby expose, within the lancet holder, the sharp tip portion of the pricking element encapsulated by the lancet cover and to locate the opening of the lancet holder in front of the sharp tip portion of the pricking element.
Public/Granted literature
- US20070225742A1 Lancet Assembly Public/Granted day:2007-09-27
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