Invention Grant
- Patent Title: Free-cutting copper alloy containing very low lead
- Patent Title (中): 易切削铜合金含铅量极低
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Application No.: US11420623Application Date: 2006-05-26
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Publication No.: US07883589B2Publication Date: 2011-02-08
- Inventor: Keiichiro Oishi
- Applicant: Keiichiro Oishi
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Shindoh Co., Ltd.
- Current Assignee: Mitsubishi Shindoh Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Main IPC: C22C9/04
- IPC: C22C9/04

Abstract:
The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 71.5 to 78.5 percent, by weight, of copper, 2.0 to 4.5 percent, by weight, of silicon, 0.005 percent up to but less than 0.02, by weight, of lead, and the remaining percent, by weight, of zinc.
Public/Granted literature
- US20070062615A1 FREE-CUTTING COPPER ALLOY CONTAINING VERY LOW LEAD Public/Granted day:2007-03-22
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