Invention Grant
- Patent Title: Device and method for joining ceramics structural body
- Patent Title (中): 陶瓷结构体连接装置及方法
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Application No.: US11808232Application Date: 2007-06-07
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Publication No.: US07883599B2Publication Date: 2011-02-08
- Inventor: Jun Fujita , Takahisa Kaneko
- Applicant: Jun Fujita , Takahisa Kaneko
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-015355 20020124
- Main IPC: B29C65/00
- IPC: B29C65/00 ; C04B33/34 ; C04B37/00 ; B65C9/25 ; C09J5/00 ; B32B37/00 ; B32B3/12

Abstract:
There is provided a device for bonding ceramic structural bodies. In the state in which a set of ceramic structural bodies provided with a bonding agent between bonding surfaces and provided with elastic sleeves disposed on a peripheral surface of the set of the structural bodies are placed in a tubular container with an elastic sheet disposed between the elastic sleeves and the tubular container, the device is able to charge a hydrostatic pressure medium between the tubular container and the elastic sheet to press and bond the structural bodies. By bonding the ceramic structural bodies with the device, it may provide accurate positioning of the bonding surfaces. It may also provide a uniform distance between bonded surfaces, and reduce the number of bonding operations, thereby affording an excellent working efficiency.
Public/Granted literature
- US20070235128A1 Device and method for joining ceramics structural body Public/Granted day:2007-10-11
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