Invention Grant
- Patent Title: Use of a titanium-copper-nickel-based alloy
- Patent Title (中): 使用钛 - 铜 - 镍基合金
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Application No.: US11718426Application Date: 2005-10-21
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Publication No.: US07883744B2Publication Date: 2011-02-08
- Inventor: Michel Martin , Frederic Faverjon
- Applicant: Michel Martin , Frederic Faverjon
- Applicant Address: FR Andrezieux Boutheon
- Assignee: H.E.F.
- Current Assignee: H.E.F.
- Current Assignee Address: FR Andrezieux Boutheon
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Priority: FR0452535 20041105
- International Application: PCT/FR2005/050882 WO 20051021
- International Announcement: WO2006/048568 WO 20060511
- Main IPC: C23C16/00
- IPC: C23C16/00
Abstract:
A titanium-copper-nickel based alloy is used for the formation of at least one resistive thin film on a polymer substrate. The alloy comprises 50 to 80% by weight of titanium, 10 to 25% by weight of copper and 10 to 25% by weight of nickel. The thin film has a thickness between about 100 and 160 nanometres.
Public/Granted literature
- US20070297933A1 Use Of A Titanium-Copper-Nickel-Based Alloy Public/Granted day:2007-12-27
Information query
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