Invention Grant
- Patent Title: Multiple layer polymer interlayers having an embossed surface
- Patent Title (中): 具有压花表面的多层聚合物中间层
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Application No.: US12509107Application Date: 2009-07-24
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Publication No.: US07883761B2Publication Date: 2011-02-08
- Inventor: David Paul Bourcier , John Joseph D'Errico , Jean-Pierre Etienne , Gary Matis , Vincent James Yacovone
- Applicant: David Paul Bourcier , John Joseph D'Errico , Jean-Pierre Etienne , Gary Matis , Vincent James Yacovone
- Applicant Address: US MO St. Louis
- Assignee: Solutia Inc.
- Current Assignee: Solutia Inc.
- Current Assignee Address: US MO St. Louis
- Agency: Lewis, Rice & Fingersh, L.C.
- Main IPC: B32B3/30
- IPC: B32B3/30 ; B32B27/42

Abstract:
The present invention provides multiple layer interlayers having a relatively soft inner layer and relatively stiff outer layers that can be laminated without unacceptable optical distortion and used in various multiple layer glass panel type applications. Multiple layer interlayers of the present invention have surface topography that is formed by embossing the exposed surface of the interlayer, or individual layers of the multiple layer interlayer, after formation of the interlayer or layers. The embossing process is carried out under temperature conditions that prevent the transfer of the embossing to inner layers of the interlayer. By precisely controlling the embossing of the interlayer, lamination of the interlayer with a rigid substrate does not lead to unacceptable optical distortion caused by the transfer of the surface topography through outer, stiffer layers into softer, internal layers of the interlayer.
Public/Granted literature
- US20090286046A1 Multiple Layer Polymer Interlayers Having An Embossed Surface Public/Granted day:2009-11-19
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