Invention Grant
- Patent Title: Fine resinous structure, fabrication thereof, and polymerizable resin-precursor composition
- Patent Title (中): 细树脂结构，其制造和可聚合树脂前体组合物
-
Application No.: US11873024Application Date: 2007-10-16
-
Publication No.: US07883764B2Publication Date: 2011-02-08
- Inventor: Kenji Murao
- Applicant: Kenji Murao
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2006-281173 20061016
- Main IPC: B32B15/00
- IPC: B32B15/00 ; B32B17/00 ; H01L21/31 ; C29C39/00
Abstract:
Disclosed is a resinous molded article which has a fine structure of a nanometer level and includes a material containing a polymer of a polymerizable organic fluorocompound. The polymer is formed from, for example, a monomeric precursor composition containing a methacrylate and/or an acrylate in combination with a fluorine-containing photopolymerizable monomeric precursor composition miscible with the former composition.
Public/Granted literature
- US20080167396A1 Fine Resinous Structure, Fabrication Thereof, and Polymerizable Resin-Precursor Composition Public/Granted day:2008-07-10
Information query
