Invention Grant
- Patent Title: Multilayer ceramic substrate, method for producing same, and electronic component
- Patent Title (中): 多层陶瓷基板,其制造方法以及电子部件
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Application No.: US12212708Application Date: 2008-09-18
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Publication No.: US07883765B2Publication Date: 2011-02-08
- Inventor: Sadaaki Sakamoto
- Applicant: Sadaaki Sakamoto
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2006-154257 20060602
- Main IPC: B32B7/00
- IPC: B32B7/00

Abstract:
A multilayer ceramic substrate having high transverse strength, minimized warpage, and no delamination, has a laminated structure including an inner layer portion and surface layer portions, in which the thermal expansion coefficient of the surface layer portions is lower than the thermal expansion coefficient of the inner layer portion, the difference in thermal expansion coefficient between the surface layer portions and the inner layer portion is about 1.0 ppmK−1 or more, and the weight content of a component common to both a material constituting the surface layer portions and a material constituting the inner layer portion is about 75% by weight or more.
Public/Granted literature
- US20090011249A1 MULTILAYER CERAMIC SUBSTRATE, METHOD FOR PRODUCING SAME, AND ELECTRONIC COMPONENT Public/Granted day:2009-01-08
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