Invention Grant
- Patent Title: Halogen-free pressure-sensitive adhesive tape
- Patent Title (中): 无卤素压敏胶带
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Application No.: US11720947Application Date: 2005-12-09
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Publication No.: US07883771B2Publication Date: 2011-02-08
- Inventor: Hiroshi Umemoto , Masato Koike , Susumu Hara , Hiroshi Ichikawa
- Applicant: Hiroshi Umemoto , Masato Koike , Susumu Hara , Hiroshi Ichikawa
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2004-358774 20041210
- International Application: PCT/JP2005/022679 WO 20051209
- International Announcement: WO2006/062196 WO 20060615
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B60C1/00 ; C08L1/00 ; C08L33/06
Abstract:
A halogen-free pressure-sensitive adhesive tape including a tape substrate made of a non-halogen resin composition containing no halogen elements and, applied to at least one side of the substrate, a pressure-sensitive adhesive containing a modified acrylic resin obtained by copolymerizing acrylic acid or an acrylic ester with a monomer which forms a tackifier resin.
Public/Granted literature
- US20100009181A1 Halogen-Free Pressure-Sensitive Adhesive Tape Public/Granted day:2010-01-14
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