Invention Grant
US07883783B2 Electrodeposited copper foil with carrier foil on which a resin layer for forming insulating layer is formed, copper-clad laminate, printed wiring board, method for manufacturing multilayer copper-clad laminate, and method for manufacturing printed wiring board
有权
具有形成绝缘层的树脂层的载体箔的电沉积铜箔，覆铜层压板，印刷布线板，多层覆铜层压板的制造方法以及印刷布线板的制造方法
- Patent Title: Electrodeposited copper foil with carrier foil on which a resin layer for forming insulating layer is formed, copper-clad laminate, printed wiring board, method for manufacturing multilayer copper-clad laminate, and method for manufacturing printed wiring board
- Patent Title (中): 具有形成绝缘层的树脂层的载体箔的电沉积铜箔，覆铜层压板，印刷布线板，多层覆铜层压板的制造方法以及印刷布线板的制造方法
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Application No.: US10593152Application Date: 2005-03-15
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Publication No.: US07883783B2Publication Date: 2011-02-08
- Inventor: Seiji Nagatani
- Applicant: Seiji Nagatani
- Applicant Address: JP Tokyo
- Assignee: Mitsui Mining & Smelting Co., Ltd.
- Current Assignee: Mitsui Mining & Smelting Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2004-075235 20040316
- International Application: PCT/JP2005/004501 WO 20050315
- International Announcement: WO2005/087489 WO 20050922
- Main IPC: B32B15/08
- IPC: B32B15/08
Abstract:
An electrodeposited copper foil with carrier foil on which a resin layer for forming an insulating layer is formed, comprising a carrier foil, a bonding interface layer, an electrodeposited copper foil with smooth surfaces on both sides and a resin layer. The resin layer is composed of 20 to 80 parts by weight of an epoxy resin and a curing agent, 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer and optionally a curing accelerator in a suitable amount.
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