Invention Grant
US07883905B2 Process for producing a BST thin-film capacitor having increased capacity density and reduced leakage current density
有权
具有增加的容量密度和降低的漏电流密度的BST薄膜电容器的制造方法
- Patent Title: Process for producing a BST thin-film capacitor having increased capacity density and reduced leakage current density
- Patent Title (中): 具有增加的容量密度和降低的漏电流密度的BST薄膜电容器的制造方法
-
Application No.: US11989600Application Date: 2006-07-28
-
Publication No.: US07883905B2Publication Date: 2011-02-08
- Inventor: Hitoshi Saita , Kiyoshi Uchida , Kenji Horino , Eri Aizawa
- Applicant: Hitoshi Saita , Kiyoshi Uchida , Kenji Horino , Eri Aizawa
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JPP2005-222270 20050729
- International Application: PCT/JP2006/315012 WO 20060728
- International Announcement: WO2007/013604 WO 20070201
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
It is an object of the invention to provide a process for production of a thin-film capacitor that can simultaneously achieve improved capacity density and reduced leakage current density for barium strontium titanate thin-films. There is provided a process for production of thin-film capacitors that includes a metal oxide thin-film forming step in which an organic dielectric starting material is fired to form a barium strontium titanate thin-film, wherein the firing atmosphere used is an oxygen-containing inert gas atmosphere, and the barium strontium titanate thin-film formed by the process has a larger capacity density than the capacity density of the barium strontium titanate thin-film fired in an oxygen atmosphere.
Public/Granted literature
- US20090176345A1 Process for producing thin-film capacitor Public/Granted day:2009-07-09
Information query
IPC分类: