Invention Grant
- Patent Title: Parameter measurement using multi-layer structures
- Patent Title (中): 使用多层结构的参数测量
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Application No.: US12630676Application Date: 2009-12-03
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Publication No.: US07883907B2Publication Date: 2011-02-08
- Inventor: Ted L. Taylor
- Applicant: Ted L. Taylor
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01R31/26

Abstract:
Various embodiments disclosed herein include methods for measuring a parameter associated with a workpiece. Such a method may include providing a first overlay pattern on the workpiece and a second overlay pattern over the first overlay pattern. The first overlay pattern may comprise a first plurality of features spaced apart from each other, and the second overlay pattern may comprise a second plurality of substantially optically transmissive features spaced apart from each other. The second plurality of features may be offset with respect to and partially overlapping the first plurality of features. The method may further comprise directing light onto the first and second overlay pattern such that the light is reflected from both the first and second overlay patterns and using reflectometry to obtain a measure of the parameter from the reflected light.
Public/Granted literature
- US20100073690A1 PARAMETER MEASUREMENT USING MULTI-LAYER STRUCTURES Public/Granted day:2010-03-25
Information query
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