Invention Grant
US07883915B2 Method of making nitride semiconductor laser, method of making epitaxial wafer, and nitride semiconductor laser
有权
制造氮化物半导体激光器的方法,制造外延晶片的方法和氮化物半导体激光器
- Patent Title: Method of making nitride semiconductor laser, method of making epitaxial wafer, and nitride semiconductor laser
- Patent Title (中): 制造氮化物半导体激光器的方法,制造外延晶片的方法和氮化物半导体激光器
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Application No.: US12429322Application Date: 2009-04-24
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Publication No.: US07883915B2Publication Date: 2011-02-08
- Inventor: Masaki Ueno , Takashi Kyono
- Applicant: Masaki Ueno , Takashi Kyono
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Leigh D. Thelen
- Priority: JPP2008-115661 20080425
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of making a nitride semiconductor laser comprises forming a first InGaN film for an active layer on a gallium nitride based semiconductor region, and the first InGaN film has a first thickness. In the formation of the first InGaN film, a first gallium raw material, a first indium raw material, and a first nitrogen raw material are supplied to a reactor to deposit a first InGaN for forming the first InGaN film at a first temperature, and the first InGaN has a thickness thinner than the first thickness. Next, the first InGaN is heat-treated at a second temperature lower than the first temperature in the reactor, while supplying a second indium raw material and a second nitrogen raw material to the reactor. Then, after the heat treatment, a second InGaN is deposited at least once to form the first InGaN film.
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