Invention Grant
US07883915B2 Method of making nitride semiconductor laser, method of making epitaxial wafer, and nitride semiconductor laser 有权
制造氮化物半导体激光器的方法,制造外延晶片的方法和氮化物半导体激光器

Method of making nitride semiconductor laser, method of making epitaxial wafer, and nitride semiconductor laser
Abstract:
A method of making a nitride semiconductor laser comprises forming a first InGaN film for an active layer on a gallium nitride based semiconductor region, and the first InGaN film has a first thickness. In the formation of the first InGaN film, a first gallium raw material, a first indium raw material, and a first nitrogen raw material are supplied to a reactor to deposit a first InGaN for forming the first InGaN film at a first temperature, and the first InGaN has a thickness thinner than the first thickness. Next, the first InGaN is heat-treated at a second temperature lower than the first temperature in the reactor, while supplying a second indium raw material and a second nitrogen raw material to the reactor. Then, after the heat treatment, a second InGaN is deposited at least once to form the first InGaN film.
Information query
Patent Agency Ranking
0/0