Invention Grant
- Patent Title: Multi-chip device and method for manufacturing the same
- Patent Title (中): 多芯片器件及其制造方法
-
Application No.: US12412466Application Date: 2009-03-27
-
Publication No.: US07883918B2Publication Date: 2011-02-08
- Inventor: Hee Bok Kang
- Applicant: Hee Bok Kang
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2006-0015660 20060217
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A multi-chip device includes LED sensors for sensing light separated by a predetermined interval in a wafer, LEDs for emitting light formed over the wafer respectively corresponding to the LED sensors, a driving circuit formed between the LEDs over the wafer, an insulating film over the wafer, and trenches in the insulating film exposing the LEDs.
Public/Granted literature
- US20090186432A1 MULTI-CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-07-23
Information query
IPC分类:
