The present invention is directed to a method and electronic computer package that is formed by placing an integrated circuit, having a plurality of bonding pads with solder bumps deposited thereon, in contact with the substrate so that one of the plurality of solder bumps is in superimposition with respect to one of the contacts and one of the plurality of bonding pads, with a volume being defined between region of the substrate in superimposition with the integrated circuit. A portion of the volume is filled with a quantity of underfill. A fluid flow barrier is formed on the substrate and defines a perimeter of the volume, defining a flow restricted region. The fluid flow barrier has dimensions sufficient to control the quantity of underfill egressing from the flow restricted region.