Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11618773Application Date: 2006-12-30
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Publication No.: US07883965B2Publication Date: 2011-02-08
- Inventor: Shin Gyu Choi , Seung Chul Oh
- Applicant: Shin Gyu Choi , Seung Chul Oh
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Townsend and Townsend and Crew LLP
- Priority: KR10-2006-0072021 20060731; KR10-2006-0130210 20061219
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device includes a device isolation structure, a recess channel structure, and a gate electrode. The device isolation structure is formed in a semiconductor substrate to define an active region. The recess channel structure is disposed in the semiconductor substrate under the active region. The gate electrode includes a holding layer disposed in a gate region to fill the recess channel structure. The holding layer prevents a seam and a shift of the seam occurring in the recess channel structure.
Public/Granted literature
- US20080023753A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2008-01-31
Information query
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